| 摘要 |
PROBLEM TO BE SOLVED: To prevent back diffusion from a vent line and sticking of materials to the vent line while constituting equipment simply and at a low cost. SOLUTION: In the substrate processing equipment, liquid material 4 for treating a wafer 1 is evaporated and supplied to a treatment furnace 2 from a liquid material delivery line 6, and exhausted through a discharge line 7 with a high vacuum pump 13 for liquid material and a rough vacuum pump 14 for rough length of the downstream. In such an equipment, a liquid material vent line 20 is branched from the liquid material delivery line 6, and connected with a part between a high vacuum pump 13 for liquid material and the rough vacuum pump 14 for rough length. A heater 15 for keeping a line warm is installed on the line including certain liquid material vent line 20 of the need of maintaining more than predetermined temperature. COPYRIGHT: (C)2005,JPO&NCIPI
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