发明名称 |
Circuit component built-in module and method for manufacturing the same |
摘要 |
A circuit component built-in module includes the following: an electrical insulating substrate made of a first mixture including a filler and a thermosetting resin; a wiring pattern formed on at least a principal surface of the electrical insulating substrate; circuit components that are arranged inside the electrical insulating substrate and connected electrically to the wiring pattern; and vias for electrically connecting the wiring patterns. At least one of the circuit components is mounted using wires. Part or all of the wires is sealed with a second mixture including a filler and a resin. This circuit component built-in module can eliminate a wire failure or short circuit while using a low cost mounting technique such as wire bonding.
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申请公布号 |
US2005045369(A1) |
申请公布日期 |
2005.03.03 |
申请号 |
US20040926879 |
申请日期 |
2004.08.26 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
ISHIMARU YUKIHIRO;SUGAYA YASUHIRO;ASAHI TOSHIYUKI |
分类号 |
H01L23/31;H01L23/433;H01L25/16;H05K1/18;H05K3/20;H05K3/40;H05K3/46;(IPC1-7):H05K1/00;B23P19/00 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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