| 摘要 |
A semiconductor device allows a second seal portion 8 made of a conductive resin to function as an electromagnetic wave shield for a photodetector 3 and a control IC chip 5 sealed with a first seal portion 7 made of a light-transmitting resin, when a third lead 1c for grounding of a lead frame 1 is connected to a ground terminal on a board. Conductive portions 21, 22 of the second seal portion 8 fill through holes 16, 17 provided for projecting portions 10, 11 of the lead frame 1 so as to be in close contact with peripheral surfaces 16A, 17A of the through holes 16, 17. The through holes 16, 17 have peripheral surfaces 16A, 17A of a rectangular-columnar shape. The semiconductor device is capable of obtaining a sufficient electromagnetic shielding effect, while it is small and low-cost, having a high degree of mounting freedom on a board.
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