| 摘要 |
A memory module includes a substrate having a common substrate body, a plurality of first memory chips located over a surface of the common substrate body, a conductive pattern which electrically connects at least some of the plurality of first memory chips, and an external terminal which is electrically connected to the conductive pattern. The memory module further includes at least one second memory chip mounted over a respective one of the plurality of first memory chips and electrically connected to the conductive pattern, where each one of the plurality of first memory chips mounted below the at least one second memory chip is disabled. |
