REPAIR APPARATUS OF SEMICONDUCTOR MEMORY DEVICE CAPABLE OF SELECTIVELY PROGRAMMING IN WAFER TEST MODE AND IN POST PACKAGE TEST MODE, AND REPAIR METHOD THEREOF

摘要

PURPOSE: A repair apparatus of semiconductor memory device is provided to repair lots of fail memory cells with small occupancy by being programmed for both wafer test mode and post package test mode selectively. CONSTITUTION: A repair apparatus of semiconductor memory device comprises a repair control circuit(253) for programming one of the first fail memory cell address signal during the wafer test process or the second fail memory cell address signal during the post package test process; a redundancy memory cell array(251) for repairing one of a first fail memory cell or a second fail memory cell by being activated; a redundancy row decoder(252) for activating some of the redundancy memory cells by being enabled. Wherein, a normal decoder is disabled when the redundancy row decoder is enabled.