| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating method which can employ various metals for preventing the electromigration of a wiring material. SOLUTION: This electroless plating method comprises attaching a second metallic element on a substrate by using a liquid including ions of the second metallic element, then forming the film of a first metal by electroless plating, and annealing the substrate. As a result, the second metal is segregated in grain boundaries of the first metal, prevents the move of the first metal, and reduces its electromigration. Here, the second metal has only to be attached onto the substrate, and need not be deposited together with the first metal by electroless plating, so that a wide range of materials can be used as the second metal. COPYRIGHT: (C)2005,JPO&NCIPI
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