发明名称 |
ELECTROCHEMICAL MACHINING APPARATUS AND ELECTROCHEMICAL MACHINING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To electrochemical-machine even a vulnerable material so as not to destroy a device formed on a substrate; and to further uniformize the machined amount within the surface of the substrate and the roughness of the surface after having been machined, by increasing the uniformity of a contact pressure of an electrode onto the substrate during machining. SOLUTION: This electrochemical machining apparatus comprises a substrate-holding part 42 for holding the substrate; an electrode base 62 provided with an electrode member 60 which machines the substrate held by the substrate-holding part 42 while contacting with the substrate in the presence of a liquid; and a support base 70 for float-supporting the electrode base 62 through a float mechanism 72. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005054205(A) |
申请公布日期 |
2005.03.03 |
申请号 |
JP20030206147 |
申请日期 |
2003.08.05 |
申请人 |
EBARA CORP |
发明人 |
YASUDA HOZUMI;NOMICHI IKUTARO;HIROKAWA KAZUTO;IIIZUMI TAKESHI;OBATA ITSUKI |
分类号 |
C25F3/12;C25F3/00;C25F7/00;H01L21/28;H01L21/3205;H01L21/3213;H01L21/768;(IPC1-7):C25F3/12;H01L21/320;H01L21/321 |
主分类号 |
C25F3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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