发明名称 ELECTROCHEMICAL MACHINING APPARATUS AND ELECTROCHEMICAL MACHINING METHOD
摘要 PROBLEM TO BE SOLVED: To electrochemical-machine even a vulnerable material so as not to destroy a device formed on a substrate; and to further uniformize the machined amount within the surface of the substrate and the roughness of the surface after having been machined, by increasing the uniformity of a contact pressure of an electrode onto the substrate during machining. SOLUTION: This electrochemical machining apparatus comprises a substrate-holding part 42 for holding the substrate; an electrode base 62 provided with an electrode member 60 which machines the substrate held by the substrate-holding part 42 while contacting with the substrate in the presence of a liquid; and a support base 70 for float-supporting the electrode base 62 through a float mechanism 72. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005054205(A) 申请公布日期 2005.03.03
申请号 JP20030206147 申请日期 2003.08.05
申请人 EBARA CORP 发明人 YASUDA HOZUMI;NOMICHI IKUTARO;HIROKAWA KAZUTO;IIIZUMI TAKESHI;OBATA ITSUKI
分类号 C25F3/12;C25F3/00;C25F7/00;H01L21/28;H01L21/3205;H01L21/3213;H01L21/768;(IPC1-7):C25F3/12;H01L21/320;H01L21/321 主分类号 C25F3/12
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