摘要 |
PROBLEM TO BE SOLVED: To detect an area where defective short circuiting generated between the first and second wiring pattern groups is generated, in a substrate provided with the first and second wiring pattern groups formed to be brought into a condition insulated each other. SOLUTION: This device/method is provided with a current generation part 5 for making a prescribed measuring current flow between an inspection point on a wiring pattern included in the first wiring pattern group, and an inspection point on a wiring pattern included in the second wiring pattern group, a voltage measuring part 6 for measuring a voltage generated therebetween, and a control part 12 for measuring a resistance value between the inspection points by a four terminal measuring method, based on measured voltage and a measuring current value, and for detecting a package substrate WC where the short circuiting is generated between the first and second wiring pattern groups, out of the package substrates WC constituting the substrate 101, based on the measured resistance value between the inspection points, in the every package substrate WC constituting the substrate 101. COPYRIGHT: (C)2005,JPO&NCIPI
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