| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable SAW device with high quality, sufficiently absorbing stress such as thermal deformation by seam welding and the like, making wire bonding in good connection to be possible and excellent in vibration characteristics and temperature characteristics responding to requirements of higher frequency and precision. SOLUTION: The SAW device is prepared by mounting SAW element 5 to the base 1 of a package 4, connecting the bonding pad 10 and a connection terminal 11 of the package with a bonding wire and tightly sealing by seam welding a lid 2 to a base. The SAW element 5 is adhered and fixed to a mounting surface 6 of the base by using an electroconductive adhesive 7 comprising 80-85 wt.% resin material and 20-15 wt.% flaky electroconductive filler 14 or an electroconductive adhesive comprising 82.5-85 wt.% resin material and 17.5-15 wt.% electroconductive filler in which the electroconductive filler comprises 30 wt.% small particle electroconductive filler 21 and 70 wt.% large particle electroconductive filler 22. COPYRIGHT: (C)2005,JPO&NCIPI |
