| 摘要 |
The electrodes are formed by surface coating and cold compression on metal strips. They are then assembled, by hot pressing, with an electrolytic membrane. The metal strips are then removed, preferably by mechanical detachment. Current collectors are then formed on each of the electrodes by PVD type techniques that are conventional in microelectronics. The resulting thin micro-battery with high surface capacity can then be integrated in an integrated circuit, in particular by bonding by means of indium connecting balls. |
