| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding compound for sealing use excellent in electrical insulation reliability, and to provide an electronic component device sealed with the compound, seldom causing electrical property defects and good in appearance and laser marking such as for YAG. SOLUTION: The epoxy resin molding compound for sealing use essentially comprises (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) a colorant and (E) an inorganic filler. In this molding compound, the colorant D is two or more kinds selected from a black organic pigment, phthalocyanine-based compound and titanium-based black pigment, which are included at 0.01-1.0 wt.% in this molding compound respectively. COPYRIGHT: (C)2005,JPO&NCIPI |
