| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiating characteristics of a semiconductor device with a simple constitution. SOLUTION: In order to make shortest the heat radiating route of the semiconductor integrated circuit 10 of the semiconductor device 1, a protective film 26 is laminated upon the integrated circuit 10 and heat radiation is performed by exposing a metallic film 30 on the circuit board side on which the semiconductor device 1 is mounted or on the opposite side. Alternatively, the metallic film 30 is constituted of upper and lower metallic films connected to each other through a stress relieving film interposed between the metallic films, or a metallic sheet serving as a heatsink is disposed on the metallic film 30. COPYRIGHT: (C)2005,JPO&NCIPI |
