| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for sealing a through-hole for acquiring a sealing status of a through-hole with high quality and high yield without generating any bending failure due to a grinding pressure even in an especially thin printed circuit board. SOLUTION: This method for sealing a through-hole is characterized to seal one side of the through-hole of a print wiring board to construct a pseudo-bottomed structure, and to pack and seal hole padding materials inside the bottomed structure. COPYRIGHT: (C)2005,JPO&NCIPI
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