GAS-COLLECTING UNIT, TEST HEAD, AND IC DEVICE TESTING APPARATUS

摘要

Disclosed is a cover (5) for cooling heating devices which covers an IC device (44) mounted on a substrate (4). A cooling liquid flows through inside of the cover (5) and comes into contact with the IC device (44) for cooling. A groove (bypass) (54) through which air and the cooling liquid can flow is so formed within the cover (5) as to extend from a gas-clogged section where a gas is likely to stagnate to a downstream position of the cooling liquid relative to the gas-clogged section. In the cover (5) for cooling heating devices having such a structure, air in the gas-clogged section flows out through the bypass, thereby efficiently eliminating the gas-clogged section.