发明名称 |
HIGH MOBILITY MISFET SEMICONDUCTOR DEVICE ON SILICON SUBSTRATE WITH CAVITY AND A METHOD FOR PRODUCING SAME |
摘要 |
<p>A low-cost semiconductor device with low defect density and improved mobility is disclosed which has a high mobility strained silicon structure which enables to realize a high-performance MISFET. As a high mobility strained silicon structure for realizing a high-performance MISFET, a relaxed silicon-germanium film/silicon-germanium film with varying concentration is formed on a silicon substrate with a cavity, and then a strained silicon film is formed thereon. By having such a structure, restraint on the lattices near the cavity is loosened, thereby increasing the degree of freedom. Consequently, the silicon-germanium film can be made thin and thus there can be obtained a low-cost semiconductor device with low defect density and improved mobility.</p> |
申请公布号 |
WO2005020314(A1) |
申请公布日期 |
2005.03.03 |
申请号 |
WO2004JP11988 |
申请日期 |
2004.08.20 |
申请人 |
WAKABAYASHI, HITOSHI;NEC CORPORATION;OGURA, ATSUSHI |
发明人 |
WAKABAYASHI, HITOSHI;OGURA, ATSUSHI |
分类号 |
H01L21/764;H01L21/8234;H01L29/10;(IPC1-7):H01L21/336;H01L29/78;H01L21/265 |
主分类号 |
H01L21/764 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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