FILM-TYPE PACKAGE AND CIRCUIT FILM FOR ZIGZAG PAD IC CHIP USING ALL LEAD WITH SAME LENGTH

摘要

PURPOSE: A film-type package and a circuit film for a zigzag pad IC(integrated Circuit) chip are provided to prevent the cutting off of a lead by forming all leads with the same length regardless of the position of a chip pad and a chip bump. CONSTITUTION: All leads(34) of a circuit film have the same length. An IC chip comprises a plurality of chip pads arrayed in two or more zigzag rows. The circuit film comprises a base film, a plurality of leads. The plurality of leads formed on the lower surface of the base film is contacted with the chip pad. The IC chip further comprises bumps(14a,14b) formed on the respective chip pads. The bumps contact with the respective leads.