RAPID THERMAL PROCESSING APPARATUS DETECTING PREVIOUSLY BREAKAGE OF WAFER USING WAFER DETECTOR

摘要

PURPOSE: A rapid thermal processing apparatus is provided to detect previously the breakage of wafer before the next process by using a wafer detector. CONSTITUTION: The space for a thermal process is provided by a process chamber. A ring-shaped cylinder(32) formed at the inside of the process chamber is rotated in the predetermined direction by a driver. A wafer(W) is seated on the upper surface of an edge ring(31) formed on an upper side of the cylinder. A heating unit(50) is provided with a lamp array operated by applying a separated voltage by each zone thereof, also the heating unit formed on the upper side of the process chamber is spaced apart from the edge ring by a predetermined distance. The defect of an edge portion of the wafer is inspected by a wafer detecting unit(70).