| 摘要 |
PROBLEM TO BE SOLVED: To increase throughput in a dual substrate stage double-exposure lithography. SOLUTION: A process treatment of first wafer pairs is performed, the wafers of the first wafer pairs are exchanged, and each wafer is patterned by a first reticle sequentially. The first reticle is exchanged for a second reticle, the wafers of the first wafer pairs are exchanged, and each wafer is sequentially patterned by the second reticle. The first wafer pairs are exchanged for second wafer pairs, the process treatment of the second wafer pairs is performed, the wafers of the second wafer pairs are exchanged, and each wafer is sequentially patterned by the second reticle. The first reticle is exchanged for the second reticle, the wafers of the second wafer pairs are exchanged, and each wafer is sequentially patterned by the first reticle. COPYRIGHT: (C)2005,JPO&NCIPI
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