发明名称 SUBSTRATE CUTTING TOOL
摘要 PROBLEM TO BE SOLVED: To avoid the deformation of a substrate cutting tool used in a scribe cutting method so as to apply uniform pressure to a substrate to be cut, and to improve durability of the tool. SOLUTION: The substrate cutting tool 20A used for cutting the substrate by forming a scribe groove in one surface of the substrate formed from an inorganic material such as glass, and cutting the substrate along the scribe groove by applying a pressure from the other surface of the substrate has a bar main body 210 connected to a prescribed pressing means and a pressing body 220 for directly applying the pressure onto the substrate, which is attached to the tip part 221 of the bar main body 210. The bar main body 210 is made of a metal, and the pressing body 220 is made of a hard rubber. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005053721(A) 申请公布日期 2005.03.03
申请号 JP20030284418 申请日期 2003.07.31
申请人 OPTREX CORP;NIPPON SEIKI CO LTD 发明人 TOGAWA YASUHIRO
分类号 B28D1/22;C03B33/10;(IPC1-7):C03B33/10 主分类号 B28D1/22
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