| 发明名称 |
JUNCTION SUBSTRATE AND METHOD OF BONDING SUBSTRATES TOGETHER |
| 摘要 |
<p>A junction substrate includes a first substrate (1), a buffer film (2) formed on one surface of the first substrate, a metal containing film (3a) formed on the buffer film and having a lower resistance than the buffer film, and a second substrate (4) bonded to the other surface of the first substrate (1).</p> |
| 申请公布号 |
WO2005018798(A1) |
申请公布日期 |
2005.03.03 |
| 申请号 |
WO2004JP11863 |
申请日期 |
2004.08.12 |
| 申请人 |
CASIO COMPUTER CO., LTD.;NAKAMURA, OSAMU;TAKEYAMA, KEISHI;TERAZAKI, TSUTOMU |
发明人 |
NAKAMURA, OSAMU;TAKEYAMA, KEISHI;TERAZAKI, TSUTOMU |
| 分类号 |
G01N37/00;B01J19/00;B01L3/00;C01B3/32;C03C17/22;C03C17/34;C03C27/00;C03C27/10;(IPC1-7):B01J19/00 |
主分类号 |
G01N37/00 |
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