| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board, wherein an insulating coating film having a fine aperture hole can be formed and a high density mounting is possible, and also to provide its manufacturing method. <P>SOLUTION: In this printed wiring board, solder resist composed of thermosetting resin is printed on the surface of an insulating substrate 7 having a conductor circuit 6. Next, an insulating coating film 1, having a low thermal expansion coefficient, is formed by thermally curing the solder resist. Then, an opening 10 for exposing a conductor circuit 6 is formed by irradiating an opening forming portion with a laser beam 2 and burning it off. The opening may be used as a conducting hole by forming a metal plating film on the inner wall. It is desirable that an external connecting pad be formed so as to cover the opening. The metal plating film is formed by using an electroplating lead, but it is preferable that the electroplating lead be cut and eliminated by using a laser, after electroplating. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
