| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To fix a heatsink for increasing wiring density and packaging density in a printed circuit board without providing any holes and packaging inhibition areas in a heat radiating structure for electronic equipment, and to improve heat radiation efficiency. <P>SOLUTION: Thermal conductive grease 12 is applied to a keyboard backing plate 8, and a compression spring 5 is inserted into a pin 6 fixed to the keyboard backing plate 8 by caulking, screwing, or the like. Then, a guide hole 3b of the heat sink 3 is positioned to the pin 6 for insertion and an E ring 7 is forced in a groove 6a provided in the pin 6 for preventing the heat sink 3 from disengaging. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
