| 摘要 |
PROBLEM TO BE SOLVED: To allow a circuit sensitive to temperature change and a heat source to coexist in an integrated circuit area. SOLUTION: A thermosensitive device 12a is shielded from a heat generating device 12b on a same integrated circuit 10 by providing an optimal trench 14a for insulating thermally the heat generating device 12b from the thermosensitive device 12a. In one embodiment, the trench 14b is formed by rear corrosion penetrating entirely an integrated circuit wafer. As a result, the trench 14b can be filled with an insulating material 18. COPYRIGHT: (C)2005,JPO&NCIPI
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