| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board including a resistance body of a smaller size having higher resistance value than an existing resistance body. SOLUTION: This method comprises processes including a step (a) to form an etching resist on a metal layer of an insulated substrate including the metal layer, a step (b) to remove the metal layer of a part which becomes a resistance body together with an etching means, a step (c) to coat the entire surface of the insulated substrate with a resistive material, a step (d) to remove the metal layer and a resistive material except for the part which becomes the resistance body together with the etching of the metal layer, a step (e) to form a wiring layer on the entire surface of the insulated substrate by conducting non-electrolyte plating and electrolyte plating, a step (f) to form an etching resist on the wiring layer, and a step (g) to remove the wiring layer on the resistance body by etching and to form a wiring pattern. COPYRIGHT: (C)2005,JPO&NCIPI
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