METHOD FOR MANUFACTURING AN ELECTRONIC MODULE, AND AN ELECTRONIC MODULE

摘要

This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. A conductive adhesive, preferably an anisotropically conductive adhesive, is used in the gluing. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.