A package assembly for electronic components that allows for low-cost multiple cavities as well as a multiple compartment structure that allows more components in a smaller package size. In one embodiment the present invention is a multi-cavity package having at least one substrate forming at least one cavity with the substrate coupled to a shelf within the sidewalls of the package.
申请公布号
WO2005020288(A2)
申请公布日期
2005.03.03
申请号
WO2004US27058
申请日期
2004.08.19
申请人
VECTRON INTERNATIONAL;STEVENS, DANIEL, S.;MINK, JEFFREY, T.