Current processor unit has housing containing conductor and signal areas with chip running temperature compensation program connected through bond wires to current and signal pins

摘要

A current processor unit has a housing containing a conductor frame with current conductor area (100) and chip area (102) with the chip (110) connected by bond wires (120, 122, 150-154) to the conductor (140, 142) and signal (146, 148) pins and running a temperature compensation program : Independent claims are included for the procedures used to manufacture the current processor using a conductor frame mounted chip.