| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate, a multi-layer wiring board incorporating a semiconductor device, which, when a plurality of wiring substrates containing the semiconductor device mounted thereon are stacked and integrally fused, can avoid generation of a wiring distortion or deformation in the semiconductor device itself or between the semiconductor and the wiring substrate, can avoid generation of a defect including a wiring failure such as open- or short-circuiting, can prevent formation of a void and therefore prevent reduction of a moisture absorption reflow heat resistance, thus achieving a fine wiring pitch in a three-dimensional mounting module, realizing a stable operational characteristic of the semiconductor device or the wiring substrate, and enhancing the reliability of the semiconductor device or the wiring substrate; and to provide a method for manufacturing the wiring board. SOLUTION: When a plurality of wiring substrates including a semiconductor device mounted thereon are stacked and integrally fused, a perforated wiring substrate 3 having an opening 16 formed therein for accommodating the semiconductor device is used, the planar shape of the opening 16 not having 5 or more recesses 10. COPYRIGHT: (C)2005,JPO&NCIPI
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