| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ball grid array package including a substrate having top and bottom surfaces. <P>SOLUTION: The package is characterized in that circuits components are arranged on the bottom surface; the circuit components have a pair of end portions; a pair of conductors are arranged on the bottom surface; the conductors are connected to the end portions of the circuit components; conductive epoxy covers a part of the conductors and a part of the bottom surface; the conductive epoxy electrically contacts with the conductors; balls are connected to the conductive epoxy; the conductive epoxy contacts between the conductors and the balls; the balls are preferably made of copper, and later treated by corrosion-resistance coating; and other embodiment in which the balls are removed and the through holes of the substrate are filled with the conductive epoxy is shown. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
