| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer that is connected between an integrated circuit element and a connecting-destination wiring board and can reduce crosstalk among signal via conductors disposed in a matrix. SOLUTION: The interposer 10 has an intermediate coefficient of linear expansion between those of the integrated circuit element 30 and the connecting-destination wiring board 20, and relieves the strains of the circuit element 30 and the wiring board 20 caused by thermal expansion. In the interposer 10, grounding-surface conductors GP electrically connected to grounding via conductors are contained in a dielectric layer 11 among via conductors which are disposed on the surface of the dielectric layer 11 in a matrix after passing through the dielectric layer 11 in the thickness direction. COPYRIGHT: (C)2005,JPO&NCIPI |
