| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering apparatus for suppressing heat spots. SOLUTION: A block-shaped heater unit 23 containing a sheath heater 46 and dissolving solder 21 contained in a soldering tank 22 is included. The solder 21 contained in the soldering tank 22 is dissolved by the block-shaped heater unit 23, so that the contact area of the heater unit 23 with the solder is made larger than that in the case that heaters are individually used so as to uniformize the surface temperature, and further, the surface shape is simplified to make the solder 21 smoothly flow in the soldering tank 22. Thus, heat spots can be suppressed. COPYRIGHT: (C)2005,JPO&NCIPI
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