发明名称 |
Polishing apparatus and method |
摘要 |
There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate effectively holding a work and an adhering method for a work capable of adhering the work on the work holding plate with high precision. The polishing apparatus comprises: a polishing table(29); and a work holding plate(38), wherein a work held on the work holding plate(38) is polished supplying a polishing agent solution(41) in the apparatus, and in polishing action, an amount of deformation of the polishing table(29) in a direction normal to an upper surface thereof with respect to the upper surface thereof and/or an amount of deformation of the work holding plate(38) in a direction normal to a work holding surface thereof is restricted to 100 m or less by forming the polishing table(29) in one-piece, contriving flow paths of cooling water and others.
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申请公布号 |
US2005048882(A1) |
申请公布日期 |
2005.03.03 |
申请号 |
US20040964624 |
申请日期 |
2004.10.15 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
KIUCHI ETSUO;HAYASHI TOSHIYUKI |
分类号 |
B24B37/015;B24B37/04;B24B37/12;B24B37/14;B24B37/30;B24B41/04;B24B41/06;B24B49/14;B24B55/02;B24B57/02;(IPC1-7):B24B5/00 |
主分类号 |
B24B37/015 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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