发明名称 |
Thin bond-line silicone adhesive composition and method for preparing the same |
摘要 |
Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.
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申请公布号 |
US2005049350(A1) |
申请公布日期 |
2005.03.03 |
申请号 |
US20030647680 |
申请日期 |
2003.08.25 |
申请人 |
TONAPI SANDEEP;ZHONG HONG;SCHATTENMANN FLORIAN JOHANNES;DAVID JENNIFER LYNN;SAVILLE KIMBERLY MARIE;GOWDA ARUN VIRUPAKSHA;ESLER DAVID RICHARD;PRABHAKUMAR ANANTH |
发明人 |
TONAPI SANDEEP;ZHONG HONG;SCHATTENMANN FLORIAN JOHANNES;DAVID JENNIFER LYNN;SAVILLE KIMBERLY MARIE;GOWDA ARUN VIRUPAKSHA;ESLER DAVID RICHARD;PRABHAKUMAR ANANTH |
分类号 |
C08L83/04;C09J183/04;H01L23/373;H01L23/42;(IPC1-7):C08K3/00 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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