发明名称 Particle-free polishing fluid for nickel-based coating planarization
摘要 A particle-free polishing fluid for planarizing nickel or nickel-alloy coating on substrates is disclosed. The particle-free polishing fluid contains at least one oxidizing agent, or mixtures thereof. The particle-free polishing fluid may also contain an accelerating agent and/or a complexing agent. Surface roughnesses of less than about 1.51 Å are possible when polishing magnetic disks with the particle-free polishing fluid in a final step polishing process.
申请公布号 US2005045852(A1) 申请公布日期 2005.03.03
申请号 US20030652176 申请日期 2003.08.29
申请人 AMEEN JOSEPH G.;HUYNH DAVE;LIU ZHENDONG;QUANCI JOHN;VESPA LILLIAN 发明人 AMEEN JOSEPH G.;HUYNH DAVE;LIU ZHENDONG;QUANCI JOHN;VESPA LILLIAN
分类号 B24B37/00;B24B1/00;B24B7/19;B24B7/30;C09G1/04;C09K3/14;C09K13/00;C23F3/06;(IPC1-7):B24B1/00 主分类号 B24B37/00
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