Halbleiteranordnung

摘要

A semiconductor device is composed of a base plate; at least one insulating plate with at least one conductive member attached on the top surface of the insulating plate, the back surface of the insulating plate facing the surface of the base plate, which is mounted on the base plate; a case surrounding the insulating plate; semiconductor elements contained in the case; wherein a region between the edge part of the conductive member and the peripheral part of the insulating plate is covered with insulating resin or non-organic glass, and the outer edge of the insulating resin or the non-organic glass is located between the edge part of the conductive member and the peripheral part of the insulating plate; whereby the reliability in the withstand voltage of the power semiconductor device is improved.