| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an IC chip which allows the easy handling of a wafer with an orientation flat even if it is polished to a thickness of 50μm or less and prevents damages thereto, allowing the wafer to be processed with good workability. SOLUTION: The method of manufacturing the IC chip from the wafer 1 with an orientation flat 2 at least comprises a process 1 of fixing the wafer 1 to a support plate with a double-sided pressure-sensitive adhesive tape 4 composed of a pressure-sensitive adhesive, whose a single side or both sides are lowered in adhesiveness by stimulation, a process 2 of grinding the wafer 1 fixed to the support plate 3, a process 3 of pasting a dicing tape to the polished-side face of the wafer 1, a process 4 of lowering the adhesiveness of the double-sided pressure-sensitive adhesive tape 4 by applying stimulation, and a process 5 of lifting the support plate 3 from on the wafer 1. In the process 5, the end of the support plate 3 opposite to a part facing the orientation flat vertically is lifted ahead of the part facing the orientation flat vertically. COPYRIGHT: (C)2005,JPO&NCIPI |
