发明名称 METHOD AND DEVICE FOR INSPECTING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To enable the precise and short-time inspection of a circuit board of an inspection object. SOLUTION: An electric parameter between a probe 3 brought into a portion insulated to each conductor pattern Ps and an inner layer beta pattern Pc in the vicinity of a conductor pattern Pax is measured as a first measurement value. The probe 3 is brought into contact with the conductor pattern Pax and an electric parameter between the probe 3 and the inner layer beta pattern Pc is measured as a second measurement value. The difference value between the measured second and first measurement values is calculated, and compared with a corresponding reference value to inspect the quality of the conductor pattern Pax. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005055210(A) 申请公布日期 2005.03.03
申请号 JP20030206409 申请日期 2003.08.07
申请人 HIOKI EE CORP 发明人 MURAYAMA RINTARO;SATO YOSHINORI
分类号 G01R31/02;G01R27/26;H05K3/00;(IPC1-7):G01R31/02 主分类号 G01R31/02
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