| 摘要 |
In order to transfer a layer comprising for example at least one monocrystalline material, which preferably but not exclusively is a semiconductor material, from a first substrate to a second substrate, an adhesive may be deposited either on the transfer layer or the second substrate in a way so as to avoid forming a bond with the first substrate. The adhesive may, for example, be deposited over a maximum of the whole surface of the layer, and the second substrate may be bonded with the layer via the adhesive. Once bonded, the first substrate is may be released from the transfer layer, e.g., through detachment. The adhesive may be deposited on the layer to the maximum extent of the edges(s) of the film or layer when the edge(s) is/are set back from the edge(s) of the first substrate, or set back from the edge(s) of the film or layer when the edge(s) is/are plumb with the edge(s) of the first substrate.
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