Stapelanordnung eines Speichermoduls

摘要

A metallization (4) is arranged on an active side of each memory chip, and connected to the bond pad (3) of the memory hip. The metallizations of each individual component (1) is identical. The central regions of each memory chip are provided with an encapsulation (7) which is stacked on the carrier substrate with the same alignment to each other. The encapsulation constitutes a spacer between the chips. Each metallization is connected electrically to the carrier substrate.