IC MODULE, ITS MANUFACTURING METHOD, IC CARD, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a low-cost efficient IC module and a manufacturing method for it and to provide an IC card having good adhesiveness between the IC module and an IC card substrate and a manufacturing method for the IC card.

SOLUTION: In this IC module having a substrate and an IC component having an IC chip and an antenna arranged on the substrate, the antenna is formed by transfer. The IC module is arranged between first and second sheet materials, and the first and second sheet materials are laminated with each other via an adhesive layer.

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