| 摘要 |
PROBLEM TO BE SOLVED: To enable the high precision detection of an alignment mark arranged in a high vacuum chamber by using a sensor arranged outside the chamber. SOLUTION: An index mark 8 arranged in an evacuated chamber 11 is illuminated by an index mark illuminating unit 7 arranged in the chamber 11. The position of the index mark 8 is measured by an imaging unit 10 and a position measuring unit 18 arranged outside the chamber 11. A wafer mark WM on a wafer W arranged in the chamber 11 is illuminated by an alignment-dedicated illuminating unit 1 arranged in the chamber 11, and its position is measured by the imaging unit 10 and the position measuring unit 18. The position of the wafer mark WM relative to the index mark 8 is determined, based on the measured positions of the index mark 8 and the wafer mark WM. COPYRIGHT: (C)2005,JPO&NCIPI
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