| 摘要 |
PROBLEM TO BE SOLVED: To prevent deterioration with the lapse of time in solder wettability on posttreatment for the surface of tin or tin alloy plating and to quicken and simplify the posttreatment. SOLUTION: The posttreatment liquid is used to the posttreatment for a tin based plating face after the formation of a tin or tin alloy plating film on an object to be plated, and comprises at least one kind of resin for posttreatment selected from the group consisting of an acrylic resin, a maleic resin, an alkyd resin and a phenol resin having the average molecular weight in a specified range. Since the tin based plating face is surface-treated with the posttreatment liquid comprising the specified resin for posttreatment having the limited average molecular weight, deterioration with lapse of time in solder wettability in the plating face with the lapse of time can be prevented. Further, the deterioration in the solder wettability with the lapse of time can further effectively be prevented by limiting the acid value and softening point, the equivalent of hydroxyl groups and softening point or oil length in the resin for the posttreatment. COPYRIGHT: (C)2005,JPO&NCIPI
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