| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-side adhesive tape which, even when IC chips are produced from an extremely thin wafer having a thickness of about 50μm, causes no failure, etc., of the wafer, sharply improves handling properties, can be favorably processed to the chips, and can be easily released by giving stimulation thereto, and to provide a producing method of the IC chips using the double-side adhesive tape. SOLUTION: The double-side adhesive tape comprises having, on at least one side of the tape, an adhesive layer containing a gas generator which generates a gas by giving stimulation, the tape having an electrified content of≤5kV. COPYRIGHT: (C)2005,JPO&NCIPI
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