FILLING VIAS WITH THICK FILM PASTE USING CONTACT PRINTING

摘要

The present invention relates to a process for filling vias in an electronic structure with thick film paste. The vias may be preexisting in a substrate comprised of thick film materials or fabricated in a photoresist layer over-coating the substrate. The invention is particularly useful in fabrication of electron field emission triode arrays where the vias are of fine dimension (< 100 µm in diameter) and the electron emitter thick film paste, which may contain carbon nanotubes, is of high value.