| 发明名称 |
Sputtering target assembly and sputtering apparatus using the same |
| 摘要 |
A sputtering target assembly includes a backing plate of which both surfaces are evenly formed and a target having one surface that is evenly formed and attached to one surface of the backing plate and the other surface that is formed with different thicknesses according to a location thereof.
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| 申请公布号 |
US2005045470(A1) |
申请公布日期 |
2005.03.03 |
| 申请号 |
US20040965833 |
申请日期 |
2004.10.18 |
| 申请人 |
PARK JAE YEOL |
发明人 |
PARK JAE YEOL |
| 分类号 |
G02F1/13;C23C14/34;H01J37/34;(IPC1-7):C23C14/32 |
主分类号 |
G02F1/13 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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