METHOD FOR MANUFACTURING MULTI-LAYER CIRCUIT BOARD AND RAW MATERIAL FOR CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board for easily improving the resin permeability of a bump, and provide raw materials for a circuit board to be used for its method. SOLUTION: This method for manufacturing a circuit board is configured to overlap a film 4 made of insulating resin on a bump 3 for interlayer connection arranged in a circuit board 1, and to abut and pressurize the pump to the film, and to connect the pump through the film to another layer. This method for manufacturing a circuit board is configured to abut and pressurize the pump to the film to form a crack occurrence resulting in crack development in the film. This raw material for a circuit board as configuring the circuit board having the bump for interlayer junction is provided with the bump formed with an edge forming the crack in the film when the bump is pressurized to the film made of insulating resin at a predetermined part. COPYRIGHT: (C)2005,JPO&NCIPI