| 摘要 |
PROBLEM TO BE SOLVED: To use a tin-zinc solder, since it is impeded to form a weak intermetallic compound consisting of tin, gold and nickel by bonding zinc concentrating on a solder ball surface with nickel plating, thereby a mechanical reliability of a solder bump joint is improved. SOLUTION: In place of a tin-lead solder constituting a former solder vamp, since a solder ball configured by a solder alloy which bases on tin and includes zinc is used, zinc layers concentrating on the solder ball surface participate with all bondings, thereby a reaction of the tin forming the weak intermetallic compound is impeded. COPYRIGHT: (C)2005,JPO&NCIPI |
