| 摘要 |
A semiconductor integrated circuit comprises a semiconductor substrate, a heat-producing circuit element formed in a multi-layer structure on the semiconductor substrate and performing a predetermined operation while producing heat of a relatively high temperature, a plurality of temperature-dependent circuit elements, each formed in a multi-layer structure in a predetermined location on the semiconductor substrate, performing a predetermined operation depending on temperature of the heat-producing circuit element, and each having a constant relationship in temperature-related properties with each another, and a heat conductive layer having a heat conductivity higher than a heat conductivity of the semiconductor substrate, and covering at least a heat-producing portion of the heat-producing circuit element and the plurality of temperature-dependent circuit elements continuously so as to conduct the heat produced by the heat-producing circuit element to the plurality of temperature-dependent circuit elements. With this structure, the semiconductor integrated circuit can maintain its intended operating accuracy regardless of changes in temperature.
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