发明名称 |
VACUUM CHUCK APPARATUS AND METHOD FOR HOLDING A WAFER DURING HIGH PRESSURE PROCESSING |
摘要 |
<p>Method and apparatus for holding a wafer having a wafer dimension during processing, the vacuum chuck comprising a concave wafer platen configured force the wafer into intimate contact with the wafer platen and provide a seal therebetween when high pressure is applied to the wafer. The wafer platen for preventing matter from entering between the wafer and vacuum chuck. A groove configured in the wafer platen applies vacuum to the underside of the wafer. A plenum configured in the platen provides pressure for a predetermined amount of time between the wafer and the vacuum chuck to disengage the wafer.</p> |
申请公布号 |
WO2005018870(A1) |
申请公布日期 |
2005.03.03 |
申请号 |
WO2004US22459 |
申请日期 |
2004.07.12 |
申请人 |
SUPERCRITICAL SYSTEMS INC. |
发明人 |
HILLMAN, JOSEPH;CONCI, DENNIS |
分类号 |
B25B11/00;H01L21/683;(IPC1-7):B23Q7/00 |
主分类号 |
B25B11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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