A CONTROLLED COLLAPSE CHIP CONNECTION C4 INTEGRATED CIRCUIT PACKAGE WHICH HAS TWO DISSIMILAR UNDERFILL MATERIALS,申请号KR20057001212-传众专利搜索

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发明名称	A CONTROLLED COLLAPSE CHIP CONNECTION C4 INTEGRATED CIRCUIT PACKAGE WHICH HAS TWO DISSIMILAR UNDERFILL MATERIALS
摘要
申请公布号	KR20050019917(A)	申请公布日期	2005.03.03
申请号	KR20057001212	申请日期	2005.01.21
申请人		发明人
分类号	H01L21/56;(IPC1-7):H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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